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| 3.0x1.5 mm SMD CHIP LED LAMP APL3015MBC BLUE Features !3.0mmx1.5mm SMT LED, 1.4mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !INNER Description The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. LENS TYPE !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0330 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 1 OF4 Selection Guide Iv (mc d ) @ 20 mA Mi n . APL3015MBC BLUE ( GaN ) WATER CLEAR 7 Ty p . 20 Viewin g An g le 21/2 70 Par t No . Dic e L en s Ty p e Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l peak D 1/2 C P ar am et er Peak Wavelength Blue D ev i c e Ty p . 430 Max . Un its nm Tes t Co n d it io n s IF=20mA Dominate Wavelength Blue 455 nm IF=20mA Spectral Line Halfwidth Blue 60 nm IF=20mA Capacitance Blue 65 pF VF=0V;f=1MHz VF IR Forward Voltage Reverse Current Blue Blue 4.0 4.5 10 V uA IF=20mA V R = 5V Absolute Maximum Ratings at TA=25C P ar am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B lu e 105 30 150 5 -40C To +80C -40C To +85C Un its mW mA mA V SPEC NO: CDA0330 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 2 OF4 Blue APL3015MBC SPEC NO: CDA0330 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 3 OF4 APL3015MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0330 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/25/2001 DRAWN: M.F.CAI PAGE: 4 OF4 |
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